| 摘要 |
PURPOSE: To improve a net working rate of an apparatus by easily replacing a rear surface pad of a wafer fitting base and controlling a replacement frequency in a wafer grinding apparatus. CONSTITUTION: A rear surface pad attached to a wafer fitting base is divided into a center rear surface pad 4 in the region where a hole 3 for pressurizing and absorption during mounting or removal of the wafer on the stage and a peripheral rear surface pad 5 which will be deteriorated fast. Thereby, on the occasion of deterioration of the rear surface pad, it can be replaced easily only with replace of the peripheral rear surface pad 5. Moreover, an availability factor of the wafer grinding apparatus which can reduce the replacement frequency can be improved by forming the peripheral rear surface pad 5 with a material having a higher elasticity recovery rate than that of the center rear surface pad 4. |
