| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device which is capable of executing plating for sheating on lead frames without elevating/lowering lead frame-holding bodies, and performing a process for removing a synthetic resin burrs stuck to the lead frames which is a pre-processing stage of plating processing operation with one device. SOLUTION: This plating device is constituted of plural treating vessels 1 successively arranged in an annual form, plural lead frame-holding bodies 2 having chuck parts 3 which are used in common with an electrode and hold the plural lead frames 10 in a hanging state in parallel and circulate while successively moving among the plural treating vessels 1, and a moving device for successively synchronizing and intermittently moving the lead frame-holding bodies 2 among the treating vessels, and allows the lead frames 1 to pass through slits formed on the peripheral walls of the treating vessels 1 when the lead frame-holding bodies 2 are moving. |
