| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of parts and the number of processes at the time of mounting a light emitting element on a board, and reduce the manufacturing cost more. SOLUTION: This light emitting device has a light emitting element array 41 where at least one stack structure 51 including a light emitting layer is made on a semiconductor substrate, and a mounting board 42, and the light emitting array chip 41 is made on the mounting board 42. In this case, the main face including the stack structure 51 of the light emitting array chip 41 is a semiconductor in high carrier concentration to serve as a current injection part, and also at the mounting board 42, a junction pad 53 is made in the specified position, and the junction pad of the mounting board 42 and the semiconductor to serve as the current injection part of the light emitting element array chip 41 are connected by a bump metal 52 disposed therebetween. |
