| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily absorb variations in bump height and simplify a process by forming the uppermost bumps opposed to a circuit board of a material having the melting point lower than that of the material for the bumps thereunder. SOLUTION: A first bump 4 is formed on an electrode pad 2 on a semiconductor element 1 by ball bonding. A second bump 3 is formed on the first bump by ball bonding using a material the melting point of which is lower than that of the first bump. Formation of stacked bumps has the effect of flattening the necks of first bumps 4, positioned in the lower level, and thus evens the height of second bumps 3, positioned in the upper level. In flip chip mounting, the uppermost bumps 3 are melted and bonded to the terminal electrodes on a circuit board, and the chip is thereby connected with the circuit board. As a result, variations in bump height are absorbed, and the height of the lower bumps is unified when bumps are stacked up, this enables stable production.</p> |
