| 摘要 |
PURPOSE: To reduce manhours for fabrication, and perform a plating process without the necessity to depend upon a complicated step and further, dissipate heat efficiently by applying a plating process to spots in which chip mounting pieces are connected to an IC chip and parts which are exposed as terminals respectively. CONSTITUTION: The upper faces of chip mounting pieces 8 are plated 6 with gold as an IC chip 1 is connected to the upper face by bonding. When sealing the IC chip 1 and leads 3, 3... into a molding resin 4, the back faces of the chip mounting pieces 8 which are the parts on which the IC chip 1 is mounted, of the leads 3, 3... are exposed from the surface of the molding resin 4, and the exposed faces of the chip mounting pieces 8 serve as connecting terminals 5 to the outside. After applying the sealing process, the surfaces of the terminals 5 are plated 7 with gold. When performing the plating process 7 in the form of electroplating, a lead frame 2 is energized to apply current to each of the terminals 5 as the terminals 5 are connected integrally to each other through frames 17. Thus it is possible to electroplate plural terminals 5, 5... simultaneously. |
