| 摘要 |
The card has a plastic body (1) for the card, with an integrated circuit (2) incorporated into a recess in the plastic body. The plastic material forming the card is structurally modified along a line (5) around the integrated circuit. The integrated circuit is fixed to an intermediate support (9) which is itself fixed to the body of the card by a bead of adhesive. This bead is immediately above the structurally modified line. The structural modification to the plastic is obtained by applying a chemical which reacts with the plastic to generate structural weakness in the plastic. |
