| 摘要 |
A high performance laminating, coverlay, and bond ply adhesive which includes a high molecular weight acid terminated thermoplastic polyamide resin, an epoxy, and a high molecular weight polyester component which can be heat cured with silane and aziridine curatives to form an extremely high temperature resistant, flexible, and high bond strength adhesive is disclosed. The adhesive can be used to enhance the characteristics of polyester and polyethylene naphthalate films for use in flexible and rigid board circuitry applications as well as being an excellent adhesive for films such as polyimide for the same applications thus allowing the films to be used at temperature which are capable of withstanding high temperatures. Along with being useful as laminating adhesive, the system is stable at room temperature and thus can be stored as a free film bond ply adhesive or coated on a film for future conversion into laminate or coverlaying of electronic circuitry. |
