| 摘要 |
PROBLEM TO BE SOLVED: To enable easily supplying any solder material in an arbitrary area with an arbitrary thickness, by sending out solder material formed in a tape shape, with every specified amount, and spreading the solder material on a board for mounting while the tip of the tape-shaped solder material is fused. SOLUTION: A control part 17 judges that a solder tape 21 has come into contact with a board 1 for mounting on the basis of detection of a detector 28, and stops the ascending of a table 12. A coating tool 23 is transferred, at a specified speed, to the direction (XY direction) which is parallel to the board 1 for mounting, while the coating tool 23 is retained to the board 1 for mounting at a specified height. A roller 24 is rotated at a specified speed in accordance with transfer of the coating tool 23, and the solder tape 21 is sent out. Thereby solder material is spread on a specified coating part of the board 1 for mounting.
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