| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a chip-sized package in which a process up to a semiconductor package from the formation of a bump is reduced and whose alignment in a die bonding operation is made easy by a method wherein the gap between a semiconductor wafer which is die-bonded by the bump and a circuit board is sealed with a resin and the circuit board and the semiconductor wafer are diced into individual semiconductor chips. SOLUTION: Many bumps 2 which are lined up on a semiconductor wafer 8 are formed, the semiconductor wafer 8 is turned over, the bumps 2 are directed downward, the semiconductor wafer is placed on a circuit board 4, and it is positioned in four upper and lower as well as right and left points 9a, 9b, 9c, 9d so as to be die-bonded. Then, this assembly is passed through a reflow furnace, and the bumps 2 are melted so as to be bonded onto the circuit board 3. Then, a resin 6 is filled into the gap between the semiconductor wafer 8 and the circuit board 3, the bumps 2 are sealed, and this assembly is passed through a curing furnace so as to be hardened. Then, the semiconductor wafer 8 is cut in square shapes so as to be divided into individual semiconductor chips 1 by a dicing machine. At this time, also the circuit board 3 is diced together with the semiconductor chips 1.</p> |
