| 摘要 |
PURPOSE:To detect interposition and peeling of an intermediate layer between a substrate and a film in a non-destructive manner by a method wherein an ultrasonic wave enters at different angles from an ultrasonic propagation medium to measure and compare frequencies to minimize a the reflection factor of the reflected ultrasonic wave. CONSTITUTION:Values (f1, f2... and fn) of frequencies are determined to minimize a reflection factor of an ultrasonic wave in an angle theta at which the ultrasonic wave enters a sample having a substrate 3 and a film 2 junctioned directly through an ultrasonic propagation medium 4. Then, the values (f1, f2... and fn) of frequencies obtained from an object to be inspected are measured. When a formula of f1'/f1=f2'/f2=... fn'/fn is not held, it is judged that there exist an existence and an incomplete junction (peeling or the like) of an intermediate layer composed of another material between a solid substrate as object to be inspected and the film. This method enables implementing of a destructive detection even for an object to be inspected with an unknown film thickness and even for a thin film. |
