Container-less transfer of semiconductor wafers through a barrier between fabrication areas

摘要

A method and apparatus is presented for transferring semiconductor wafers through a barrier between two separate fabrication areas without the transfer of a container (i.e., wafer boat) with the wafers. The method includes providing an air lock chamber configured within a wall separating a first fabrication area and a second fabrication area. A first door providing access to the air lock chamber from the first fabrication area is opened and a first wafer boat containing the wafers is placed into the air lock chamber. The wafers are removed from the first wafer boat and placed in the air lock chamber. The empty first wafer boat is then removed from the air lock chamber, and the first door is closed. A second door providing access to the air lock chamber from the second fabrication area is opened, and an empty second wafer boat is placed into the air lock chamber. The wafers in the air lock chamber are then placed into the empty second wafer boat, and the second wafer boat containing the wafers is removed from the air lock chamber. The second door is then closed, completing the transfer of the wafers. In a preferred embodiment, the air lock chamber contains a mass transfer system which automatically performs the steps of (i) removing the wafers from the first wafer boat, and (ii) placing the wafers into the empty second wafer boat. The mass transfer system also stores the wafers inside the mass transfer system during the transfer operation.