| 摘要 |
PROBLEM TO BE SOLVED: To prevent particles in a transport passage from attaching to a semiconductor wafer. SOLUTION: A transport passage 1 is provided, which consists of a lower transport passage part 1a and an upper transport passage part 1b, and a gas jet nozzle 4 is provided in the lower transport part 1a, and the gas jet nozzle 4 is connected to a jet gas supplying apparatus for N2 gas, etc., and electrostatic suction bodies 3, whose positive split electrostatic suction bodies 3a and negative split electrostatic adsorbing bodies 3b are alternately arranged, are removably attached on the inner surface of the upper transport part 1b, and a direct current power supply 2 capable of supplying a controllable voltage is connected to the positive split electrostatic suction bodies 3a and the negative split electrostatic suction bodies 3b. |
