发明名称 Chipkarte und Verfahren zur Herstellung einer Chipkarte
摘要 The invention relates to a smart card (1) for the contact-free transmission of electrical signals to a terminal, with a card body in which a coupling element (2) with conducting strips (3) and contact connections (4) and a semiconductor chip (5) with an electronic circuit associated with the coupling element (2) are integrated. The semiconductor chip (5) is provided at its surface with contact elements (6) for electrical connection of the electronic circuit and contact connections (4) of the coupling element (2). A support (7) which braces at least part of the conducting strips (2) and contact connections (4) is provided. The support is made of an electrically insulating material and provided in the vicinity of the contact connections (4) of the coupling element (2) with an opening for the semiconductor chip (5).
申请公布号 DE19609636(C1) 申请公布日期 1997.08.14
申请号 DE1996109636 申请日期 1996.03.12
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 FRIES, MANFRED, DIPL.-ING. (FH), 94336 HUNDERDORF, DE;JANCZEK, THIES, DIPL.-ING., 24254 RUMOHR, DE
分类号 B42D15/10;G06K19/077;(IPC1-7):G06K19/077;H05K1/18 主分类号 B42D15/10
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