| 摘要 |
PCT No. PCT/DE94/00678 Sec. 371 Date Feb. 8, 1995 Sec. 102(e) Date Feb. 8, 1995 PCT Filed Jun. 16, 1994 PCT Pub. No. WO95/00279 PCT Pub. Date Jan. 5, 1995A process and apparatus is available for producing a bonded metal coating. Solder material constructed so as to form a solder material shaped body (18) is transported by means of an energy transfer device (13), which is guided in a capillary tube (12) and which acts in the manner of a stamp, towards a bonding surface (24) of a substrate (25). The solder material then is acted upon by energy by means of the energy transfer device (13) for shaping and connection to the bonding surface (24).
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