IMPROVED METHOD AND APPARATUS FOR SCRUBBING THE BOND PADS OF AN INTEGRATED CIRCUIT DURING WAFER SORT

摘要

An improved method and apparatus for removing the dielectric layer on bond pads of an integrated circuit includes a probe card (40, 60) with a plurality of probes (49, 62) and a piezoelectric actuator assembly (43, 70). Electrical contact is achieved between the probes (49, 62) and bond pads by using the actuator assembly (43, 70) to induce a small and rapid cyclic movement between the probes (49, 62) and the bond pads such that the probes (49, 62) pierce a dielectric layer on the surface of the bond pads.