| 摘要 |
PROBLEM TO BE SOLVED: To contrive the reliable connection and easy connection of via holes and the enhancement of the yield of the formation of the via holes and the like. SOLUTION: This hoard is constituted into a structure, wherein circuit patterns and insulating layers are laminated in order on the surface of a core board and at the same time, the circuit patterns holding each insulating layer between them are connected with each other through each via hole. In this case, the board is formed into a structure, wherein the first via hole 11 to the third via hole 13 are formed into the shape of a straight line in the laminating direction and each cap-shaped land pattern 14 or 15 is made to interpose between the via holes to connect the via holes 11 and 13 with each other. |
