| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module device which can relatively facilitate control of a gel fed amount, can prevent adhesion of the fed gel to an inner surface of a lid-shaped case, and be excellent in workability and high in reliability. SOLUTION: In the module device, a power chip 1 is mounted on a metallic substrate 3 through an insulating layer, and an external connection terminal 5 provided to the lid-shaped case 7 is connected to the power chip 1. A case 6 mounted on the metallic substrate 3 and the lid-shaped case 7 form a package for accommodating the power chip 1. The power chip 1 is sealed with gel-like resin 9. In this case, an inner upper surface of the package other than the external connection terminal 5 is made flat. The lid-shaped case 7 is formed therein with injection holes 11. The gel-like resin 9 is injected into a space 15 defined in an upper part of the interior of the package through the injection hole 11, and then set as a cured resin, thus sealing the power chip 1.</p> |
