| 摘要 |
In an electronic component cooling unit, one surface of a cold plate, on the other surface of which an electronic component is mounted, is covered with a cover member to form a tank section which accommodates refrigerant, and a pipe member is fitted in the cover member in such a manner as the pipe member is communicated with the tank section. Furthermore, the one surface of the cold plate has a recess which forms the tank section together with the cover member. The pipe member is a multi-flow-path container which is formed by extrusion molding.
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