| 摘要 |
<p>A method and apparatus for attaching contacts (32, 34) to a substrate (20) having mounting pads (24) includes the steps of positioning the substrate (20) over a fixture (40), and positioning a stencil (50) over mounting pads of the substrate (20). Soldering paste (100) is applied into openings (54) of the stencil wherein a dab of paste (36) is left in the openings of the stencil. A contact loading plate (72) is positioned over the substrate (20), the plate (72) having openings (86) with the mountings pads (24) of the substrate (20). The openings (84) of the contact loading plate (72) is removed from the substrate (20) and fixture (70) so as to leave the contacts (32, 34) on the dabs of paste (36). The substrate (20) is then heated so as to solder the contacts (32, 34) to the mounting pads (24).</p> |
