Gestapeltes Mehrschichtsubstrat zum Montieren integrierter Schaltungen

摘要

A substrate is formed from a core substrate (11) of flexible, low-temperature co-fireable ceramic tape (12) and an outer substrate of ceramic tape (15, 16) having apertures (18) for receiving integrated circuits (ICs) (20) therein. The substrate is heated to form a rigid body which then mounts the ICs. The rigid body and ICs are covered or at least partially covered with an insulating glass (24) and heated to a temperature that fuses the glass but does not harm the ICs. The resulting structure hermetically seals the ICs in a single substrate that is insensitive to acceleration forces.