发明名称 |
Carriers for IC packages |
摘要 |
Each IC package carrier holds a single ZIP or SIP package between its side walls having openings to provide air flow for cooling the package and to allow heat generated within the package to dissipate. A locking strip member is provided to prevent loosening of the held package. Locking elements of snap fasteners are mounted on the side walls to allow several IC package carriers be attached to each other for producing an IC package assembly. The IC package assembly held by the several attached carriers can be inserted into a socket to connect circuits within the packages with external circuitry.
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申请公布号 |
US5644473(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19950517122 |
申请日期 |
1995.08.21 |
申请人 |
MITSUBISHI SEMICONDUCTOR AMERICA, INC. |
发明人 |
DEROUICHE, NOUR EDDINE |
分类号 |
H05K7/10;(IPC1-7):B65D21/024;B65D21/028;B65D85/90;H01L23/055 |
主分类号 |
H05K7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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