发明名称 |
Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer |
摘要 |
A polishing method and apparatus are provided for detecting the polishing end point of a semi-conductor wafer having a polishing film and a stopper film formed thereon. First driving means are provided having a first drive shaft for rotating a polishing plate and a polishing cloth thereon. Second driving means having a second rotatable drive shaft are also provided. Mounting means for mounting the semi-conductor wafer is adapted to be rotated by the second driving means for polishing the wafer. Energy supplying means for supplying prescribed energy to the semi-conductor wafer are also included. Finally, detecting means for detecting a polishing end point of the polishing film is included and detects a variation of the energy supplied to the semi-conductor wafer. Different types of energy can be utilized such as infrared light and a vibration wave. |
申请公布号 |
US5643046(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19950390529 |
申请日期 |
1995.02.17 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KATAKABE, ICHIRO;MIYASHITA, NAOTO;AKIYAMA, TATSUO |
分类号 |
B24B37/013;B24B37/04;B24B49/04;H01L21/304;(IPC1-7):B24B49/04;B24B49/12;B24B7/22 |
主分类号 |
B24B37/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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