发明名称 |
ELECTRICALLY CONDUCTIVE COMPOSITION AND METHOD FOR THE PREPARATION AND USE THEREOF |
摘要 |
Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder. |
申请公布号 |
KR970010170(B1) |
申请公布日期 |
1997.06.21 |
申请号 |
KR19940071007 |
申请日期 |
1994.03.29 |
申请人 |
TORANAGA TECHNOLOGIES, INC. |
发明人 |
CAPOTE, MIGUEL ALBERT;TODD, MICHAEL GEORGE;MANESIS, NICHOLAS JOHN;CRAIG, HUGH P. |
分类号 |
B23K35/22;B23K35/02;B23K35/36;B23K35/363;C08K3/02;C08K3/08;C08K5/00;C08L101/00;H01B1/00;H01B1/22;H01L23/498;H01L23/538;H05K1/09;H05K1/18;H05K3/32;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):B05D5/12 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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