| 摘要 |
PROBLEM TO BE SOLVED: To prevent positional deviation between an image reformation lens and a CCD chip while preventing adhesive from being spread between the image reformation lens and the CCD chip by providing a gap between the image reformation lens and a photoelectric conversion means and bonding 1st and 2nd holding members. SOLUTION: Projection parts 5e and 5f abutting on a sensor package 11 are formed on the package 11 side of the holding part 5g of the image reformation lens 5, and their tips and the package 11 are bonded. Since the holding part 5g of the lens 5 is bonded with the package 11 through the projection parts 5e and 5f, a gap is formed between the convex lens part of the lens 5 and the surface of the CCD chip of the package 11. Thus, the adhesive bonding the projection parts 5e and 5f of the lens 5 and the package 11 does not spread between the convex lens part of the lens 5 and the CCD chip of the package 11. |
