首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Wafer-stage temperature compensation for IC components
摘要
申请公布号
GB9708597(D0)
申请公布日期
1997.06.18
申请号
GB19970008597
申请日期
1995.11.07
申请人
THAT CORPORATION
发明人
分类号
H03F1/30;H03G3/10
主分类号
H03F1/30
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Template free and polymer free metal, nanosponge and a process thereof
External preparation for the skin
Modified live (JMSO strain) Haemophilus parasuis vaccine
Cationic betaine precursors to zwitterionic betaines having controlled biological properties
Formulation for pulmonary administration of antifungal agents, and associated methods of manufacture and use
Apparatus and method for producing polycrystalline silicon having a reduced amount of boron compounds by forming phosphorus-boron compounds
Heat exchange unit for isothermal chemical reactors
Methods and compositions for inhibiting corrosion
Plasma processing apparatus and plasma processing method
Oil recovery system and method
Method of membrane separation and membrane separation apparatus
Sucrose inversion process
Process for plating a metal object with a wear-resistant coating and method of coating
Asymmetric synthesis of rocaglamides via enantioselective photocycloaddition mediated by chiral bronsted acids
Conductive film and method for making same
Plasma processing apparatus and method
Vacuum cleaner and method of controlling the same
Surgical drill guide
Integrated pharmaceutical production, quality, assurance, and safety system (IQS)
Semiconductor device
