发明名称 Method of forming a semiconductor device using a self-aligned contact
摘要 A semiconductor device using a self-aligned contact and a method for manufacturing the same is disclosed. A gate electrode having a first spacer formed on the sidewalls thereof is formed on a semiconductor substrate. Active regions which are spaced apart from each other by the gate electrode are formed in the semiconductor substrate. A bitline having a second spacer formed on the sidewalls thereof is formed on the gate electrode and the active regions. A self-aligned contact is formed on the active regions and a first pad electrode connected with the active region through the contact is formed between the bitlines. A bitline contact is formed on the bitline, and second and third pad electrodes, which are respectively connected with the bitline and the first pad electrode through the bitline contact, are formed on the bitline. Thus, the alignment tolerances of the bitline contact and the storage-node contact are maximized, so that a reliable semiconductor device can be realized.
申请公布号 US5639682(A) 申请公布日期 1997.06.17
申请号 US19950552535 申请日期 1995.11.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOE, HYUN-CHEOL
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L21/70;H01L27/00 主分类号 H01L27/04
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