| 摘要 |
<p>PROBLEM TO BE SOLVED: To electrically connect all of the electrodes of each of image element arrays to electrode wiring patterns on a base plate at one time even in the case where the number of the electrodes is markedly great by a method wherein the electrodes of each of the image element arrays are electrically connected to the electrode wiring patterns bonded to one main face side on the base plate by a flip chip connection manner. SOLUTION: Imaging device is so constituted that a lens member 3 consisting of a plurality of lenses 7 and a base plate 1 formed of a transparent glass wherein electrode wiring patterns 1a are provided to one main face side thereof and multiple image element arrays 2 are arranged straight to be mounted, are juxtaposed to be fixed so as to be in a one-to-one correspondence between each of the lenses 7 and the respective image element arrays 2. The electrode wiring patterns 1a are made of a metal that is obtained by thermally decomposition of organometallic compound and are bonded to the base plate 1 with bismuth therebetween.</p> |
