Process for coating a metal substrate for packaging end use

摘要

PCT No. PCT/GB93/01418 Sec. 371 Date Mar. 1, 1995 Sec. 102(e) Date Mar. 1, 1995 PCT Filed Jul. 6, 1993 PCT Pub. No. WO94/01224 PCT Pub. Date Jan. 20, 1994A process for coating a metal substrate for packaging end use by applying to a primary substrate a thermosettable composition which is free of added solvent and has a residual solvent content not exceeding 10% derived from the manufacture of any of the ingredients. The composition is applied as a thermosettable film by extrusion in melt (including plastified) form through an extrusion coating die onto a substrate. There is relative movement between the die and the substrate so that successive areas on the substrate are coated with the thermosettable composition, so as to form a film. The primary substrate is the metal substrate for packaging end use or an intermediate temporary support from which the applied coating is transferred onto the metal substrate for packaging end use. The applied coating is thermally cured after extrusion through the extrusion coating die. Compositions suitable for use in this and other coating processes are described.