| 摘要 |
<p>A method of manufacturing a small electronic component with an improved yield. The method comprises the mounting step of mounting required electronic components (2-4) on a printed wiring board (1) by soldering, the coating layer forming step of forming a coating layer (14) which encapsulates the whole of the printed wiring board (1) including the electronic components (2-4) with a coating material having a superior heat resistance, and the package layer forming step for forming a package layer (17) which encapsulates the coating layer (14) with a thermoplastic resin material. In the package layer forming step, the coating layer (14) restrains the heat of the thermoplastic resin material from affecting the electronic components (2-4), the printed wiring board (1) and the like.</p> |
