发明名称 SUBSTRATE PROCESSOR
摘要 <p>PROBLEM TO BE SOLVED: To improve the workability of the maintenance job performed from backside of the device in relation to a cool plate. SOLUTION: A cool plate CP 1 accessible by a carrier robot both from backside and frontside of a device provided with an aluminum plate 30 for cooling down the mounted substrate to be arranged in a vessel 35 from the central part thereof to the left. Beside, the supporting pins 32 penetratingly provided on this aluminum plate 30 are connected to a cylinder 36 through the intermediary of a connecting member 33. This connecting member 33 intersecting with the putting in and out directions of the substrate by the carrier robot beneath the aluminum plate 30 (arrow marks Y1, Y2 in the figure) and extending over the right side of the aluminum plate 30 to be engaged with the cylinder 36 arranged on the right side of the aluminum plate 30.</p>
申请公布号 JPH09153539(A) 申请公布日期 1997.06.10
申请号 JP19950337888 申请日期 1995.12.01
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MATSUSHITA MASANAO
分类号 B65G49/07;H01L21/027;H01L21/31;H01L21/316;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B65G49/07
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