| 摘要 |
A board handling apparatus for receiving, collecting, and stacking boards cut to length by a sawing device includes a frame, a plurality of take-away conveyors adjustably secured to the frame for receiving and collecting the boards, a scissor lift mechanism secured generally under the take-away conveyors for lifting a platform, and a pair of extendable fingers operably supported on the platform for raising/extending/lowering/retracting movement for stacking the collected boards on a pallet. The take-away conveyors are adjustably secured to the frame so that their spacing can be adjusted to an optimal spacing. Also, additional take-away conveyors can be added if desired. The fingers are adjustably secured on the platform so that their spacing can be adjusted to an optimal spacing. Additional fingers can be attached to the platform if desired. Also, additional lift mechanisms can be added with additional platforms to expand the capability of the board handling apparatus. A controller is operably connected to the scissor lift mechanism(s) to provide manual, semiautomatic or automatic operation.
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