| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation property of a package by providing gel-form resin between a semiconductor chip and a metallic cap thereby radiating the heat generated in the semiconductor chip to a mounting board through the metallic cap or a lead by heat conduction from both sides of top and bottom of the semiconductor chip. SOLUTION: Liquid-form resin 19 is applied on the rear of a cap 18, and this liquid-form resin 19 is gelled by heating, and the underside of the gelled resin 19 is joined to the surface of the semiconductor chip 12 exclusive of the bonding wire 16 for connecting the bonding pad 17 of the semiconductor chip 12 with a ceramic header 13, and sealing is performed by the cap 18. By having provided gel-form resin 19 between the semiconductor chip 12 and the metallic chip 18, the heat generated in the semiconductor chip 12 is radiated effectively to the metallic cap 18 by heat conduction from both sides of top and bottom of the semiconductor chip 12 or to the mounting board 11 through a lead 14. Accordingly, the heat radiation property of the package 15 pan be improved. |
