| 摘要 |
PROBLEM TO BE SOLVED: To inspect whether the operation of a circuit is good or bad, inspecting the voltage of power or seeing waveform of an electric circuit, even in condition that BGA is mounted on a mother board, by exposing a part of the electric path connected electrically with a BGA terminal, without covering it with an insulator, on the topside of the wiring board of BGA. SOLUTION: For a semiconductor device, a metallic fine wire 7, a wiring 4 on the topside of a wiring board 1, a via hole 6a, and a wiring 5 on the downside of the wiring board constitute an electric path leading to a globular electrode 3 from a semiconductor element 2. And, on the topside of the wiring board 1 of a ball grid array(BGA), a part of the wiring 4 being one part of this electric path is exposed without being covered with an insulator such as solder resist 10, sealing resin 8, etc. Therefore, even in condition that BGA is mounted on a mother board, it can be checked whether the operation of the circuit is good or bad by applying the probe of an oscilloscope and inspecting the power voltage, or seeing the waveform of electric signals. |
