发明名称 SUBSTRATE PROCESSOR
摘要 PROBLEM TO BE SOLVED: To level stack a hot plate of a substrate heating process part, etc., by a method wherein an exhaust member is integrally formed in a stack direction of stacking the substrate heating process part and/or a substrate cooling process part, and a plurality of substrate heating process parts and/or substrate cooling process parts are supported by this exhaust member and stacked. SOLUTION: An exhaust member 91 formed by extending a system exhaust duct 14 in a Z direction is vertically provided on the side between substrate heating process parts 11 and substrate cooling process parts 12 provided parallel in an X shaft direction (in a clearance between respective columns of a heat process part 1). The respective exhaust members 91 are integrally structured at an interval between the substrate cooling process parts 12 stacked on a lowermost layer and the substrate heating process parts 11 stacked on an uppermost stage. Then, the substrate cooling process parts 12 and the substrate heating process parts 11 of each stage are supported by a rail 92 fitted on each of the exhaust members 91 and stacked in a Z shaft direction. An opening 14a for communicating each of process chambers 79, 82 with the exhaust duct 14 is formed on a side face of these exhaust members 91.
申请公布号 JPH09148240(A) 申请公布日期 1997.06.06
申请号 JP19950329889 申请日期 1995.11.24
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MATSUSHITA MASANAO;FUKUTOMI YOSHIMITSU
分类号 H01L21/677;H01L21/027;H01L21/68;(IPC1-7):H01L21/027 主分类号 H01L21/677
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