MANUFACTURE OF SEMICONDUCTOR ELEMENT IN WHICH REAR SURFACE OF WAFER IS POLISHED BY UV OVERSENSITIVE TAPE

摘要

PROBLEM TO BE SOLVED: To avoid using other chemical substance for removing an UV-sensitive tape, etc., from a semiconductor wafer by removing the tape with irradiation of ultraviolet rays on the surface of the wafer by a new wafer back side polishing step. SOLUTION: An UV-sensible tape 35 is laid on the surface of a wafer 30 having an original thickness W1 with circuit elements mounted thereon, the back side of the wafer is polished, using a polisher 37 to reduce the thickness to W2, ultraviolet ray is applied to the tape laid on the polished wafer 30 and the tape is removed. Irradiating the ultraviolet ray on the tape activates a photo initiator to initiate a rapid photosetting reaction to lower the adhesion, thereby easily removing the tape from the wafer.