| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield of this optical pickup element itself by forming reflection parts by anisotropic etching on a photodiode substrate formed with a pair of photodetecting parts Si. SOLUTION: Then one surface 30A of an Si wafer substrate 30 is polished to a mirror finished surface and the non-polished surface 30B is stuck to a film. (not shown in Fig.) Next, the Si wafer substrate 30 is first cut at an equal pitch in a perpendicular axis Aa direction by setting the angle at 45 deg. with the perpendicular axis Aa of a wafer surface (one surface 30A). The Si wafer substrate 30 is thereafter rotated 90 deg. within the plane and is cut this time perpendicular to a Bb axis direction. The film is expanded to separate chips in a manner as to be used in cutting of ordinary semiconductor chips after this cutting. The mirror chips 26 of a low cost are thus obtd. |
