Abdeckstreifen für eine Reihenanordnung für elektronische Bauelemente.
摘要
A cover tape (10) for sealing chips (4) in chip-holding parts (3) of a carrier tape (1) having said parts provided discontinuously and longitudinally of said carrier tape, which cover tape comprises a base tape (11), an adhesive layer (12) formed on one surface of said base tape and a non-adhesive coat (13) formed on said adhesive layer along the longitudinal direction of said base tape so that said non-adhesive coat has a width broader than that of the chips and narrower than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.