发明名称 Package for electronic element
摘要 PCT No. PCT/JP95/00049 Sec. 371 Date Sep. 5, 1995 Sec. 102(e) Date Sep. 5, 1995 PCT Filed Jan. 19, 1995 PCT Pub. No. WO95/20244 PCT Pub. Date Jul. 27, 1995The hermetically sealed package for an electronic device of the present invention comprises a body containing an electronic device therein and a covering member, such as a cap or a lid, for covering the body. The package is characterized in that the covering member of the package comprises a metal foil, and the covering member and the body are sealed together with a resin adhesive.
申请公布号 US5635672(A) 申请公布日期 1997.06.03
申请号 US19950513989 申请日期 1995.09.05
申请人 NIPPON CARBIDE KOGYO KABUSHIKI KAISHA 发明人 KAWAURA, SHIGEHIRO
分类号 H01C1/02;H01G4/224;H01L23/02;H01L23/04;H01L23/10;H03H9/02;H03H9/10;(IPC1-7):H05K5/06 主分类号 H01C1/02
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