| 摘要 |
PROBLEM TO BE SOLVED: To prevent the formation of defective solder bumps. SOLUTION: Solder balls 3 are arranged on electrodes 5 of a substrate 4, and are pressed and deformed. The deformed solder balls 3 are melted to form solder bumps 6 on the electrodes 5. If a solder ball is little out of place, the deformed part of it is spread over the electrode. Therefore, the misplaced ball can form a solder bump on the electrode 5 by wet back when melted. |
