SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a larger area to a semiconductor chip in a package and to freely arrange electrodes on the surface of the semiconductor chip. SOLUTION: The semiconductor device comprises a semiconductor chip 6 having an electrode on a surface, an insulating substrate 1 having a recessed part for holding the semiconductor chip 6 on a reverse surface and having a through hole formed between the recessed part and the surface and an insulating substrate 2 having an opening portion formed on the surface of the insulating substrate 1. The surface of the semiconductor chip 6 is bonded to a base of the recessed part of the insulating substrate 1. The insulating substrate 1 includes a plurality of metal conductive layers 3 on a surface opposite to the surface provided with the recessed part. The electrode provided on the surface of the semiconductor chip 6 is connected to the metal conductive layers 3 by a conducting wire 8 passing through the through hole. An external terminal 4 formed on outer surfaces of the insulating substrates 1 and 2 is connected to the metal conductive layers 3. A terminal 5 formed on the reverse surface of the insulating substrate 1 and on the surface of the insulating substrate 2 is connected to the external terminal 4. The semiconductor chip 6, the conducting wire 8 and the metal conductive layers 3 are sealed with resin. A through hole is formed by forming an opening portion on the electrode.