发明名称 METHOD OF FUSING HOLLOW BOARD OF SYNTHETIC RESIN AND HOLLOW BOARD OBTAINED BY SAME
摘要 <p>An ultrasonic fusion apparatus is used for joining of a unitary thermoplastic resin extruded board (B), in which a first sheet (2a) and a second sheet (2b) are connected to each other through a multiplicity of parallel webs (3). In order to fuse the first sheet (2a) and the second sheet (2b) to each other in a linear or surface-like manner, an ultrasonic oscillation unit (6) of the ultrasonic fusion apparatus is made to abut against a surface of the first sheet (2a), and a seat portion (7) is made to abut against a surface of the second sheet (2b), so that the board (B) is pressed between the oscillation unit (6) and the seat portion (7). In order to join boards (B1, B2) to each other, both boards are made to at least partially overlap each other, ultrasonic waves are generated while an oscillation unit (6C) and a seat portion (7C) press both sides of both boards. Ultrasonic waves cause internal oscillation in the boards, and friction due to the oscillation generates heat from inside, so that fusion is effected by the fusing and the pressing forces.</p>
申请公布号 WO1997018079(P1) 申请公布日期 1997.05.22
申请号 JP1996003318 申请日期 1996.11.12
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