发明名称 LEAD FRAME PLATING MASKING ADHESIVE TAPE
摘要 PROBLEM TO BE SOLVED: To separate a tape without the tape being separated in plating and besides without a bonding agent being left on a board after plated. SOLUTION: This masking adhesive tape 1 is the laminated body of a support body 2 and an adhesive agent layer 3. The adhesive agent contains acrylic copolymer in which the ester of alcohol and acrylic acid of eight carbons is selected from various acrylic monomers and a weight average molecular weight having a repeat unit of not less than 50wt.% induced from the ester is not less than 30×10<4> , and at the same time the gel separation rate of the above- mentioned adhesive agent is adjusted so as to become less than 30%.
申请公布号 JPH09134991(A) 申请公布日期 1997.05.20
申请号 JP19950288949 申请日期 1995.11.07
申请人 SOKEN CHEM & ENG CO LTD 发明人 TONEGAWA KAZUO
分类号 C09J7/02;C09D133/04;C09J133/08;H01L23/50;(IPC1-7):H01L23/50 主分类号 C09J7/02
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