| 摘要 |
PROBLEM TO BE SOLVED: To realize sufficient contact strength of a plating film by providing, on a metal surface layer, an underlying plating layer having specified or higher contact strength with respect to a carbon fiber composite material having a specified or higher thermal conductivity in one direction. SOLUTION: A board member 1 is made of a carbon fiber composite material, and a metal surface layer made of Ni, Cu or Au is formed on the surface of the board member 1. This metal surface layer is provided with an underlying plating layer 2 having contact strength not less than 2.0kgf/mm<2> with respect to a carbon fiber composite material having a thermal conductivity of at least 300W/m.K in one direction. Thus, in performing metal plating on the board member 1, the plating layer 2 has sufficient contact strength so that a desired coefficient of thermal expansion may be secured and a high heat transfer coefficient may be realized. |
