| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve damp-proof property. SOLUTION: This device includes a light receiving chip, a light receiving chip loading lead frame 7 for loading the light receiving chip, a thermosetting transparent resin body 10 for sealing a part of the light receiving chip loading lead frame 7 and the light receiving chip, and a thermoplastic shielding resin body 11 for sealing the transparent resin body 10. In this case, at the part of the light receiving chip loading lead frame 7 sealed by the transparent resin body 10, a substantially U-shaped through hole 12 is provided in such a manner as to surround a plane corresponding to a lead-out direction of the light receiving chip loading lead frame 7 and a plane perpendicular to that plane.</p> |
