| 摘要 |
PROBLEM TO BE SOLVED: To prevent a warp from being developed by the heat shrinkage of a resin in the manufacture of an IC card storing an IC module by injection molding. SOLUTION: A front side label 1 and a rear side label 2 are arranged at a mutually opposite position in a molding die, and an IC module 4 is arranged in the center between the front side label 1 and the rear side label 2 through interspersed thermal blowing adhesive layer 8, on the opposed face of the rear side label 2. Next, a molten resin 5 is packed in a cavity between the labels 1, 2, so that both labels 1, 2 are integrally bound together with the IC module 4. After cooling and solidifying the resin 5, the molding die is opened to obtain an IC card 11. The adhesive layer 8 is blown to heave the IC module 4 up in the center between the labels 1, 2. Thus it is possible to equalize the thermal shrinkage on the front side and the rear side of the resin. |
