| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a new molding method of a lead for reducing solder whisker of a lead of a resin armor and reducing bending defect. SOLUTION: Solder whisker is reduced by pressure-welding a bending part of a lead 26 of a resin armor 25 which is mounted on a bending die 30 by a movable bending punch 21 which is supported by a punch holder 22 attached to a lower holder 20 and is installed from obliquely above as an upper holder 24 lowers. Therefore, a lead can be molded without increasing molding devices in particular and without increasing the number of molding processes and yield can be improved.</p> |
