| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor sensor with a deformable part by forming a spacer having a recess on a first wafer while an active region on a second wafer and then bonding the wafers through fusion such that a recess is located above the active region. SOLUTION: Active regions 207-209 are formed on a first semiconductor wafer 201 and a spacer is formed on a second wafer 250 by a standard MOS technology. The spacer has a recess 206, and a bonding face projecting from the circumference in order to bond the first and second wafers 201, 250 through fusion. The spacer typically has ring shape and defines the wall of cylindrical recess 206. When these wafers are bonded through fusion while being aligned, the recess 206 in the spacer of second wafer 250 can be aligned with the active regions 207-209 in the spacer of first wafer 201. Subsequently, the second wafer 250 is micromachined to form a desired deformable part. |
