发明名称 |
Semiconductor device in a resin package housed in a frame having high thermal conductivity |
摘要 |
A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
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申请公布号 |
US5625222(A) |
申请公布日期 |
1997.04.29 |
申请号 |
US19940281098 |
申请日期 |
1994.07.27 |
申请人 |
FUJITSU LIMITED |
发明人 |
YONEDA, YOSHIYUKI;TSUJI, KAZUTO |
分类号 |
H01L23/28;H01L23/08;H01L23/12;H01L23/24;H01L23/31;H01L23/367;H01L23/433;H01L23/498;H05K1/02;H05K3/30;H05K3/34;(IPC1-7):H01L23/08;H01L23/10;H01L23/34 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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