BOARD FOR MOUNTING BGA PARTS

摘要

PROBLEM TO BE SOLVED: To provide a board adaptable to the BGA parts of superhigh density with narrow ball intervals, to facilitate the positioning of the BGA parts at the time of mounting and to prevent a dislocation failure. SOLUTION: Via holes for positioning all the balls 1a of the BGA parts 1 and connecting and fixing them are formed in a board 2. A multilayer wiring board can be used as the board 2, and ring-like electrodes 8 are formed at the peripheries of the via holes on the parts mounting face 2a. The ring-like electrodes 8 are formed at the peripheries of the via holes among the layers and a wiring pattern is led out from the electrodes.