| 摘要 |
PROBLEM TO BE SOLVED: To decrease the conduction defects resulting from error in solder connection work to a half by executing solder connection via a coil bobbin terminal in an HGA stage without the execution of the solder connection of the coil bobbin terminal and a wire terminal. SOLUTION: The coil bobbin terminal has a notched groove 18 of several +μm which is nearly the same width as the outside diameter of the wire terminal 4 at its front end. The wire terminal 4 is inserted and fixed into this notched groove 18. Next, the coil bobbin terminal 17 inserted with the wire terminal 4 is inserted into the insertion hole 12 of the land part 16 of an FPC 15 via the insertion windows 11c, 11d of gimbals 11. The solder 14 is therefore, applied on the land part 16 and the coil bobbin terminal 17, by which the electrical connection of the wire terminal 4 and the land part 16 of the FPC 15 is surely executed via the coil bobbin terminal 17.
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